Cool better, compute more.
LiquiTem develops compact thermal modules that turn waste heat into liquid-metal motion and electric power — a novel technology unlocking high heat dissipation, on-board energy harvesting, and passive pump-free cooling for AI servers, HPC systems and power electronics.
Thermal bottlenecks are becoming a limiting factor for computing power.
AI accelerators, dense servers and advanced power electronics generate increasingly concentrated heat loads. Conventional air or liquid cooling architectures are reaching practical limits in energy efficiency and integration complexity, while raising concerns over water consumption.
Higher heat flux
Modern chips concentrate more power in smaller areas, increasing local temperature gradients and hot spots.
Energy overhead
Pumps, fans and auxiliary cooling infrastructure add power consumption, noise, complexity and failure modes.
Water & ressources pressure
Cooling infrastructure is becoming increasingly demanding in water, energy and materials, creating new constraints for sustainable high-performance computing.
A compact liquid-metal module designed to move heat where it matters.
LiquiTem uses the exceptional thermal and electrical properties of liquid metals to create a new class of thermal management devices. Our approach targets high heat flux removal with reduced mechanical complexity and a roadmap toward autonomous operation powered by harvested thermal energy.
What makes it different
- Superior heat spreading: Liquid metals offer up to 30× higher thermal conductivity than water, enabling compact high-flux cooling.
- Pump-free fluid motion: The system uses waste heat to drive liquid-metal flow, reducing auxiliary power and maintenance.
- Energy harvesting from heat: Magnetohydrodynamic effects create a path toward self-powered thermal management.
- Integration-ready design: Compatible with cold-plate and IHS-level integration for dense servers, AI accelerators and power electronics.
Target applications
- AI servers and GPU/accelerator cooling.
- High-performance computing and data centers.
- Power electronics and compact converters.
- Aerospace, defense and embedded high-power electronics.
From liquid-metal interfaces to thermal autonomy.
Our scientific foundation comes from research on magnetohydrodynamics at liquid-metal interfaces. By combining liquid-metal transport, energy conversion and compact thermal architectures, we aim to reduce the dependence on external pumping and conventional cooling infrastructure.
Development status
Functional passive prototype for CPU-scale thermal loads.
Intermediate prototype with assisted heat transport and improved thermal performance.
Fully autonomous module using thermally harvested energy for active cooling functions.
Cooling is becoming strategic infrastructure.
The rise of AI and high-density computing makes thermal management a key constraint for performance, reliability and energy efficiency. LiquiTem addresses this bottleneck with physics-driven hardware designed for the next wave of power-dense electronics.
Performance
Reduce hot spots and improve heat extraction close to the chip.
Efficiency
Lower the auxiliary energy cost associated with cooling infrastructure.
Scalability
Develop compact modules compatible with industrial electronic platforms.
Interested in next-generation chip cooling?
We are looking for industrial partners, early adopters and investors interested in advanced thermal management for high-power electronics.
Contact us